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Conference Introduction

Sponsored by the ministry of science and technology of People’s Republic of China and Chinese Academy and Sciences, SIP has held CHInano Conference & Expo each year since 2010.This year is going to be 12th CHInano. With 11 years success, CHInano has become the most influential conference & Expo for nano technology in China. Since 9th CHInano in 2018, Wintech Nano(Suzhou) Co. Ltd. Joined by Jiangsu Nano Technology Innovation Center has sponsored Symposium for Failure Analysis & Application in CHInano. In the past 3 years, the symposium was supported by companies, associations, universities and institutes, and attracted more than 1000 professionals from semiconductor industry.

2021 4th Symposium for Semiconductor Failure Analysis & Application will focus on failure analysis of RF IC, Filter IC and Power Device. This year symposium will share FA learnings and case studies for attendees. There will be 4 main sessions. We will invite experts, professors, researchers and engineers to discuss the most advanced failure analysis techniques and methods, and future trend of failure analysis technology and applications in semiconductor industry. 

Conference Introduction

Organization

Organized by

    Wintech-Nano (Suzhou) Co. Ltd.


supported by

    • Jiangsu Nanotech Industry Innovation & Development Center
    • China Semiconductor Industry Association MEMS Branch
    • Thermo Fisher Scientific
    • Hitachi High-Tech Scientific Solutions Co. Ltd.
    • Zeiss China
    • PHI(China) Limited
    • Espec China

Main topics

Main topics

Topics discussed at this meeting included but are not limited to:

2021 Agenda Arrangement



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Data:Oct. 28

Location:B1 Exhibition Hall Room 1

Time

Speaker

Speaker ’s Position / Organization and Speech Title

8:55-9:00

Xiaomin Li

Chairman&CEO, Wintech-Nano(Suzhou) Co. Ltd
Welcome and Opening Remark

9:00-9:25

Baoyong Chi

Professor and Vice President, Institute of Micro Electronics, Tsinghua University
Development and Innovation of Integrated Circuit Technology

9:25-9:50

Hongyu Wang

Regional President, Bosch Sensortec GmbH
Smart algorithms, embedded AI and MEMS sensors – the silent enablers of sophisticated daily-life use cases

9:50-10:15

Charles Song

General Manager, Foundry Markeitng of Samsung Electronics China
Solutions for China Fabless Tomorrow

10:15-10:30

Tea Break

10:30-10:55

Zhaobing Li

Vice President, Beijing Zhicun (WITIN) Technology Co. Ltd.
Computing-in-memory SoC

11:00-12:00

Panel Discussion

12:00-13:30

Lunch Break

13:30-13:55

Lilong Lai

Senior FA Expert
Failure Analysis in IC/Devices and Characterizations with Nano-dimension

13:55-14:20

Geng Chen

Manager, Zhejiang Raysea Technology Co Ltd.
VCSEL and its applications in consumer electronics, datacom, and automotive

14:20-14:45

Younan Hua

Vice President, Wintech-Nano (Singapore) Co. Ltd.
Studies and Application of New Failure Analysis Technique for Gate Oxide Integrity (GOI) Failure in Semiconductor Manufacturing and Wafer Fabrication

14:45-15:10

Cao Xiaoxiao

Thermo Fisher Scientific
Yield Improvements& Advanced R&D - New Progress of Thermo Fisher Failure Analysis Solutions

15:10-15:30

Tea Break

15:30-15:55

Ou Zhou

General Manager, Hitachi High-Tech Scientific Solutions (Beijing) Co. Ltd.
Application capability of Hitachi EM series products in Semiconductor field

15:55-16:20

Chengliang Huang

Business Development Manager, Carl Zeiss (Shanghai) Co., Ltd.
ZEISS microscopy solutions for semiconductor die and package failure analysis

16:20-16:45

Huanxin Ju

Application Scientist, CoreTech Integrated (Beijing) Limited
The ability of PHI surface analysis techniques（XPS/AES/TOF-SIMS）in industrial applications

16:45-17:10

Pan ChenLiang

Lab Manage & Director, ESPEC TEST TECHNOLOGY(SHANGHAI)CO., LTD
Reliability testing in semiconductor applications

17:10-17:30

Lucky Draw


Speakers

Speakers of 2021 Conference

Speakers of 2021 Conference
Baoyong Chi （Tsinghua University Professor, Vice President of IME, Tsinghua University）
TBD
1976年02月出生于湖北省孝感市，1998年7月本科毕业于北京大学计算机科学与技术系微电子学专业；同年9月进入清华大学微电子学研究所直接攻读博士学位，2003年07月获工学博士学位；同年8月进入清华大学微电子学研究所工作至今，现为清华大学集成电路学院教授，于2006年11月～2007年10月之间在美国Stanford大学电子工程系以访问学者身份进行射频/毫米波集成电路方面的研究工作。研究领域包括射频/毫米波/模拟集成电路的关键技术研究以及全集成无线收发机芯片的实现技术，曾经以负责人身份主持多项国家重大科研项目。在国内外重要期刊和国际会议上发表论文160余篇。已申请专利30余项。曾获得2005年和2011年霍英东教育基金、2009年清华大学学术新人奖等奖励，并入选2008年教育部新世纪优秀人才支持计划和2012年国家自然科学基金委优秀青年科学基金。从2005年一直担任IEEE A-SSCC国际会议的TPC成员。
研究方向：射频/毫米波/模拟集成电路的关键技术研究、全集成无线收发机芯片的实现技术
Speakers of 2021 Conference
Hongyu Wang （Bosch Sensortec GmbH Regional President ）
Smart algorithms, embedded AI and MEMS sensors – the silent enablers of sophisticated daily-life use cases
Hongyu Wang was appointed as regional president Asia Pacific of Bosch Sensortec in July 2020. He has been in the sensor and semiconductor industry for nearly 17 years. Hongyu joined the Bosch Group in 2006 and held various positions across various business units and regions.
His Bosch career started at Bosch Central Research Institute in Stuttgart. As a scientific research engineer, he was mainly responsible for the development and design of sensor-related digital signal processing hardware and algorithms. In 2009, he transferred to Bosch Automotive in Suzhou as the electronic system development manager. Since 2010, he joined Bosch Sensortec in Shanghai as ASIC project manager and department head.
At the beginning of 2018, he joined BSH Home Appliances in Nanjing and was responsible for electronic system and software development. He was appointed as the head of BSH Home Appliances Global Electronics and Motors Division for Greater China region at the end of 2019. Wang Hongyu obtained his bachelor's degree in electrical engineering from Zhejiang University, China and master's degree in electronic information technology from the University of Stuttgart, Germany.
Speakers of 2021 Conference
Charles Song （Foundry Marketing，Samsung Electronics General Manage）
Solutions for China Fabless Tomorrow
Joined Samsung Electronics (1993)
General Manager of CIS & Driver IC business in TW(2005~2010)
Director of Sales & Marketing in System LSI Division (2011~2015)
Corporate Vice President of Samsung Electronics(System LSI, 2015)
Device Solution China in Samsung Electronics (2015~)
- System LSI & Foundry Marketing General Manager (2015~2017)
- Foundry Marketing General Manager (2018~)
Speakers of 2021 Conference
LI ZHAOBING （Beijing Zhicun(WiTIN) technology VP of Manufacturing&Technology ）
TBD
17 years work experience of research and development in memory chips and mass production , now working on emerging memory RRAM/MRAM and Computing-In-Memory , more than 10 invention patents. Last decade worked in the R&D department of Global Foundries, UMC those international famous semiconductor companies, During this period, served as the R&D Project manager and was responsible for the Development and Mass production of Nanocrystal-Base Flash,SONOS, split-gate Flash and other Flash technology platforms. Those products’ application cover AIoT , EAL6+ level Security chip, Automotive MCU and Flash-base FPGA for aircraft.
Speakers of 2021 Conference
LiLung Lai （Senior Technical Expert）
Failure Analysis in IC/Devices and Characterizations with Nano-dimension
Dr.Lai received Bachelor and Master degrees in Physics from National Thing Hua university, Taiwan and Ph.D degree in material sciences from Fudan university, Shanghai, China. He has semiconductor experiences almost 24 years since 1997. The career includes the fields of Power devices, DRAM, Manufacturing Foundry, CIDM and FeRAM. Now, he serves semiconductor company as FA director to develop advanced FA methodology, technology and in charge of daily operation.
He has more than 25 paper publications on journal/conference, 15 patent issued and 15 public presentations.
Speakers of 2021 Conference
Geng Chen （Zhejiang Raysea Technology Co Ltd Manager）
VCSEL and its applications in consumer electronics, datacom, and automotive
Semiconductor optoelectronics device and reliability Specialist Nation Univ. of Singapore，M.Eng
Over 20 years’ experience in semiconductor optoelectronics devices R&D, NPI, mass production, reliability and failure analysis, covering IR imager, MEMS, LED, VCSELs and Photovoltaic. Working experience at Avago (Broadcom), GlobalFoundries，PerkinElmer Medical Imaging，Lumentum，JASolar etc. Currently in charge of VCSEL device performance and reliability enhancement. VCSELs are widely used in consumer electronics (facial recognition, robot vacuum, AR/VR, TWS, gesture recognition etc.), data com transceivers (25G, PAM4), and automotive (DMS/OMS, Lidar) applications.
Speakers of 2021 Conference
Hua Younan （Wintech-Nano (Suzhou) Co., Ltd. Vice-President）
Studies and Application of New Failure Analysis Technique for Gate Oxide Integrity (GOI) Failure in Semiconductor Manufacturing and Wafer Fabrication
Dr. Hua received a Ph.D. degree in Physics from National University of Singapore in 1994. After that he worked in Chartered Semiconductor (Globalfoundries), which is a major international wafer fab, and served as Director of Failure Analysis Lab in 1995--2013. In early 2014, he joined Wintech-Nano (Singapore) as Vice President/COO. He is an expert in semiconductor wafer fab, process and device failure analysis. He has published more than 350 papers/patents. He has deep academic attainments in the field of wafer fab, packaging and failure analysis, especially in the front-end process of wafer fab, research and development of GOI failure analysis methods and the advanced fab process of anti-pollution and corrosion on Al Bondpads in the back-end wafer fab process with the international leading level.
He is also actively engaged in and caring about education, and is assigned as a member of the Educational Advisory Committee in National University of Singapore and a PhD Supervisor (博导) (National University of Singapore/Nanyang Technological University /Singapore University of Technology and Design/Singapore Economic Development Board /Wintech-Nano IPP Platform). He is Vice-president of Jiangsu Association (Singapore).
Speakers of 2021 Conference
曹潇潇 （Thermo Fisher Scientific Senior Manager for Business Development, PFA）
助力良率提升及先进研发--赛默飞失效分析解决方案的新进展
曹潇潇，赛默飞世尔公司市场及资深业务拓展经理。2007年毕业于合肥工业大学材料学院，获得学士学位；于2007-2011年在上海大学材料研究所师从我国著名的核材料专家周邦新院士，获得硕士研究生学位。作为主要负责人，参与了中国国内首台能量过滤透射电镜、三维原子探针、X射线显微镜等先进设备的调试和应用开发。特别是气氛和液态原位电镜，以及电子束敏感样品的低剂量成像，推动了电子显微镜在化工、半导体等工业领域的广泛使用。
Speakers of 2021 Conference
Zhou Ou （Hitachi High-Tech Scientific Solutions (Beijing) Co. Ltd Specific General Manager）
Application capability of Hitachi EM series products in Semiconductor field
Mr. Zhou Ou graduated from Shanghai Jiaotong University. During the master period, he was engaged in the research of transmission electron microscope and semiconductor materials. After graduation, he joined Shanghai Grace Semiconductor, worked in failure analysis lab for many years, and accumulated plenty of application experience of various electron microscope in the semiconductor field. Then he worked in a German instrument company for many years, further expanding the understanding of electron microscope application in many industries. Now he is the specific general manager of the semiconductor industry in the electron microscope sales support department of Hitachi High-Tech Scientific Solutions (Beijing) Co. Ltd, mainly responsible for the promotion and technical support of electron microscope series products in the semiconductor industry.
Speakers of 2021 Conference
Huang, Chengliang （Carl Zeiss (Shanghai) Co., Ltd. Business Development Manager ）
ZEISS microscopy solutions for semiconductor die and package failure analysis
As a business development manager at Carl Zeiss, Chengliang Huang is responsible for Zeiss Microscopy business development in semiconductor, electronics and display industries, to provide innovative application solutions to customers.
Since his graduation from University of California, Irvine, he has been working in the field of physical and electrical failure analysis. Chengliang has solid background and more than 5 years of advanced semiconductor failure analysis experience as well as FIB/SEM, nanoprobing application development, customer support experience.
Speakers of 2021 Conference
Huanxin Ju （CoreTech Integrated (Beijing) Limited The ability of PHI surface analysis techniques （XPS/AES/TOF-SIMS）in industrial applications）
PHI表面分析技术（XPS/AES/TOF-SIMS）在产业中的应用
Dr. Ju Huanxin, Applied Scientist of CoreTech Integrated (Beijing) Limited. He received his bachelor and PhD degrees from the University of Science and Technology of China in 2009 and 2014 respectively. After graduation, he worked at the National Synchrotron Radiation Laboratory as the post-doctoral research and associate researcher, responsible for the operation of Catalysis and Surface Science Experimental Station in National Synchrotron Radiation Laboratory. His research focus on soft X-ray spectroscopy methodological research and on the electronic properties of energy materials/device interfaces. Since November 2018, he joined CoreTech Integrated (Beijing) Limited as an application scientist, responsible for the operation management of the PHI CHINA Nanjing Surface Analysis Laboratory.
Speakers of 2021 Conference
Pan ChenLiang （ESPEC TEST TECHNOLOGY(SHANGHAI)CO.,LTD Lab Manage、Director）
He is the Lab Manager and the Director of the test department in ESPEC Test Technology (Shanghai) Co., Ltd. He has been working in ESPEC over 10 years and has rich experience in the field of third-party testing.
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